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New bond issue: Semiconductor Manufacturing issued international bonds (XS1730881247) with a 2% coupon for USD 485.1m

November 29, 2017 | Cbonds

November 28, 2017 Semiconductor Manufacturing issued international bonds (XS1730881247) with a 2% for USD 485.1m. Bonds were sold at a price of 100%. Bookrunner: Barclays, Deutsche Bank, JP Morgan. Depository: Clearstream Banking S.A.

Issue: Semiconductor Manufacturing International Corporation, 2% perp., USD (Conv.)

StatusCountry of riskVolumeIssue Rating (M/S&P/F)
outstandingChina485,100,000 USD -/-/-

Company: Semiconductor Manufacturing International Corporation

Full company nameSemiconductor Manufacturing International Corporation
Country of riskChina
Country of registrationCayman Islands
IndustryInformation and High Technologies

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