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New bond issue: Xi'an Aerospace High-Tech Industry Development issued international bonds (XS2177109878) with a 3.95% coupon for USD 200.0m maturing in 2023

May 21, 2020 | Cbonds

May 19, 2020 Xi'an Aerospace High-Tech Industry Development issued international bonds (XS2177109878) with a 3.95% for USD 200.0m maturing in 2023. Depository: Clearstream Banking S.A., Euroclear Bank
Bookrunner: Bank of Communications, China Minsheng Banking, China Securities (International) Finance, DongXing Securities, Fosun Hani Securities, Industrial Bank, Shanghai Pudong Development Bank.

Issue: Xi'an Aerospace High-Tech Industry Development, 3.95% 26may2023, USD

StatusCountry of riskMaturity (option)AmountIssue ratings (M/S&P/F)
outstandingChina05/26/2023200,000,000 USD-/-/-

Company: Xi'an Aerospace High-Tech Industry Development

Full company nameXi'an Aerospace High-Tech Industry Development Co., Ltd
Country of riskChina
IndustryEngineering industry

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