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New bond issue: Chengdu Hi-tech Investment Group issued international bonds (XS1901318664) with a 6.28% coupon for USD 300.0m maturing in 2021

November 07, 2018 | Cbonds

November 06, 2018 Chengdu Hi-tech Investment Group issued international bonds (XS1901318664) with a 6.28% for USD 300.0m maturing in 2021.

Issue: Chengdu Hi-tech Investment Group, 6.28% 14nov2021, USD

StatusCountry of riskRedemption (offer)VolumeIssue Rating (M/S&P/F)
outstandingChina11/14/2021300,000,000 USD-/Baa3/-

Company: Chengdu Hi-tech Investment Group

Full company nameChengdu Hi-tech Investment Group Co Ltd
Country of riskChina
IndustryConstruction and development

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