International bonds: Lai Fung , 2014 (XS0295131980)

Issue information:

Issuer, issue numberLai Fung , 2014
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SPVLai Fung Holdings Limited
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Debt instrument typeInternational bonds
Secured bondsYes
Issue statusredeemed
Nominal, minimum settlement amountUSD 100,000
Par, integral multipleUSD 1,000
Amount200,000,000
ISIN RegSXS0295131980
Common Code RegS029513198
CFI RegSDBFXBR
Bloomberg code (BBGID)BBG00004MFR3
Day count fraction30/360 (30/360 ISDA)
End of placement04/04/2007
Coupon9.125%
Coupon frequency2 time(s) per year
Interest commencement date04/04/2007
Maturity date04/04/2014
Issuer rating on issue date (M/S&P/F)B1/B+/—
Early redemption termsCallable
Issue managersHSBC, Deutsche Bank
ListingSGX
Investment banksBookrunner:
HSBC
Deutsche Bank
Last updated issue date04/04/2014

Placement results:

Initial issue price***

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Issue ratings:

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Bond Quotes by Market Participants:

Market participantDate and timeBid/ ask price (Yield)
VTB Capital04/18/2014***.****/***.**** ( - / - )
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Stock exchange and OTC quotes:

Trading floorDate and timeBid/ ask price (Yield)Indicative price (Yield)
OTC MARKET04/02/2014***.**/***.** (-/-)***.** (-**.**%)
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Borrower:

IssuerLai Fung
Full issuer nameLai Sun Group
CountryChina
RegionAsia (excl. Japan)
Websitehttp://www.esun.com/
Other issues of the issuer (including issues by affiliated companies )Lai Fung , 2018, CNY
Issuer profileLai Fung's core businesses include the investment and development of serviced apartments, residential, office and commercial properties in prime locations in major gateway cities in China, in particul...
IndustryOther sectors

SPV:

IssuerLai Fung Holdings Limited
CountryCayman Islands
RegionLatin America
Issuer profileSPV

Payment schedule:

#Coupon dateCoupon, % Coupon size, USDRedemption of principal, USD
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